Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding

A semiconductor device has a semiconductor die with a plurality of bumps formed over an active surface of the semiconductor die. A plurality of first conductive traces with interconnect sites is formed over a substrate. The bumps are wider than the interconnect sites. A surface treatment is formed o...

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Bibliographische Detailangaben

Hauptverfasser:	KIM KYUNG OE, KANG YONG HEE, SHIM SEONG BO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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