Interpenetrating polymer network structure and polishing pad, and process for producing the same
The present invention relates to a process for producing an interpenetrating polymer network structure, which comprises the steps of impregnating a polymer molding with a radical polymerizable composition containing an ethylenically unsaturated compound and a radical polymerization initiator; and po...
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| creator | HASHISAKA KAZUHIKO NAKAYAMA HIROYUKI FUKUDA SEIJI UE MASAKI TABATA NORIKAZU SUGIMURA MASAHIRO SAKAMOTO TAKUO |
| description | The present invention relates to a process for producing an interpenetrating polymer network structure, which comprises the steps of impregnating a polymer molding with a radical polymerizable composition containing an ethylenically unsaturated compound and a radical polymerization initiator; and polymerizing the ethylenically unsaturated compound in a swollen state of the polymer molding impregnated with the radical polymerizable composition; wherein a chain transfer agent and/or a radical polymerization inhibitor are added to the radical polymerizable composition and/or the polymer molding before impregnating the polymer molding with the radical polymerizable composition. According to the present invention, a highly uniform interpenetrating polymer network structure can be obtained. The present invention also provides a polishing pad which is exhibits high in-plane uniformity of a polishing rate during polishing, and also has excellent flattening properties and improved pad lifetime during polishing, and a process for producing the same. |
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According to the present invention, a highly uniform interpenetrating polymer network structure can be obtained. The present invention also provides a polishing pad which is exhibits high in-plane uniformity of a polishing rate during polishing, and also has excellent flattening properties and improved pad lifetime during polishing, and a process for producing the same.</description><language>eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GENERAL PROCESSES OF COMPOUNDING ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TOOLS FOR GRINDING, BUFFING, OR SHARPENING ; TRANSPORTING ; WORKING-UP</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20121120&DB=EPODOC&CC=US&NR=8314192B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20121120&DB=EPODOC&CC=US&NR=8314192B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HASHISAKA KAZUHIKO</creatorcontrib><creatorcontrib>NAKAYAMA HIROYUKI</creatorcontrib><creatorcontrib>FUKUDA SEIJI</creatorcontrib><creatorcontrib>UE MASAKI</creatorcontrib><creatorcontrib>TABATA NORIKAZU</creatorcontrib><creatorcontrib>SUGIMURA MASAHIRO</creatorcontrib><creatorcontrib>SAKAMOTO TAKUO</creatorcontrib><title>Interpenetrating polymer network structure and polishing pad, and process for producing the same</title><description>The present invention relates to a process for producing an interpenetrating polymer network structure, which comprises the steps of impregnating a polymer molding with a radical polymerizable composition containing an ethylenically unsaturated compound and a radical polymerization initiator; and polymerizing the ethylenically unsaturated compound in a swollen state of the polymer molding impregnated with the radical polymerizable composition; wherein a chain transfer agent and/or a radical polymerization inhibitor are added to the radical polymerizable composition and/or the polymer molding before impregnating the polymer molding with the radical polymerizable composition. According to the present invention, a highly uniform interpenetrating polymer network structure can be obtained. The present invention also provides a polishing pad which is exhibits high in-plane uniformity of a polishing rate during polishing, and also has excellent flattening properties and improved pad lifetime during polishing, and a process for producing the same.</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</subject><subject>TRANSPORTING</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEjwzCtJLSpIzUstKUosycxLVyjIz6nMTS1SAIqU5xdlKxSXFJUml5QWpSok5qWAZDOLM8DqElN0IEJF-cmpxcUKaflFIHZKaTJIuiQjVaE4MTeVh4E1LTGnOJUXSnMzKLi5hjh76KYW5MenFhckJoPsjg8NtjA2NDG0NHIyMiZCCQDTBz3D</recordid><startdate>20121120</startdate><enddate>20121120</enddate><creator>HASHISAKA KAZUHIKO</creator><creator>NAKAYAMA HIROYUKI</creator><creator>FUKUDA SEIJI</creator><creator>UE MASAKI</creator><creator>TABATA NORIKAZU</creator><creator>SUGIMURA MASAHIRO</creator><creator>SAKAMOTO TAKUO</creator><scope>EVB</scope></search><sort><creationdate>20121120</creationdate><title>Interpenetrating polymer network structure and polishing pad, and process for producing the same</title><author>HASHISAKA KAZUHIKO ; 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and polymerizing the ethylenically unsaturated compound in a swollen state of the polymer molding impregnated with the radical polymerizable composition; wherein a chain transfer agent and/or a radical polymerization inhibitor are added to the radical polymerizable composition and/or the polymer molding before impregnating the polymer molding with the radical polymerizable composition. According to the present invention, a highly uniform interpenetrating polymer network structure can be obtained. The present invention also provides a polishing pad which is exhibits high in-plane uniformity of a polishing rate during polishing, and also has excellent flattening properties and improved pad lifetime during polishing, and a process for producing the same.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GENERAL PROCESSES OF COMPOUNDING GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING WORKING-UP |
| title | Interpenetrating polymer network structure and polishing pad, and process for producing the same |
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