Shape measurement apparatus and shape measurement method

An apparatus and method are provided for measuring the end surface of a disk-shaped semiconductor wafer based on its projection image, without the influence of contaminants on the end surface. A rotation supporting mechanism supports a wafer between a first supporting position rotated by +δrelative...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HASHIZUME HIDEHISA, AKAMATSU MASARU, NAKAI YASUHIDE
Format:	Patent
Sprache:	eng
Schlagworte:	ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION TESTING
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