Method and apparatus for electroplating

An apparatus for electroplating a layer of metal on the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer (preferably within 5 mm of the wafer surface) which serves to modulate ionic current at the wafer surface, and a second catho...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HE ZHIAN, PONNUSWAMY THOMAS, MAYER STEVEN, BRELING PATRICK, REID JONATHAN, BUCKALEW BRYAN, IBARRETA GLENN, PARK SEYANG, VARADARAJAN SESHASAYEE, PENNINGTON BRYAN
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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