Edge protection seal for bonded substrates

A dielectric material layer is deposited on exposed surfaces of a bonded structure that includes a first substrate and a second substrate. The dielectric material layer is formed on an exposed planar surface of a second substrate and the entirety of peripheral sidewalls of the first and second subst...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KINSER EMILY, AKINMADE-YUSUFF HAKEEM B. S, WISE RICHARD S, FAROOQ MUKTA G
Format: Patent
Sprache:eng
Schlagworte:
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