Transport apparatus for elongate substrates

In a transport device for elongated substrates, especially in hot processes, which includes an essentially rectangular frame, formed by longitudinal and transverse spars connected to each other, in which at least three transverse spars are provided between two longitudinal spars, at least one transv...

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Bibliographische Detailangaben
Hauptverfasser:	STRUEMPFEL JOHANNES, GOERKE STEFFEN, SCHWERDTFEGER FALK, ULBRICHT ANDRE, BAUER REINHARDT, HEISIG ANDREAS, RICHTER HEIKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	In a transport device for elongated substrates, especially in hot processes, which includes an essentially rectangular frame, formed by longitudinal and transverse spars connected to each other, in which at least three transverse spars are provided between two longitudinal spars, at least one transverse spar is made from a material, whose heat expansion coefficient differs from the heat expansion coefficient of the material of the other transverse spars or/and at least one transverse spar is connected force-free to at least one transverse support or/and at least one transverse spar is formed from an open profile.