Silicate composite polishing pad

The invention provides a polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. It includes a polymeric matrix having a polishing surface. Polymeric microelements are distributed within the polymeric matrix and at the polishing surface of the polymeric mat...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CAMERON, JR. COLIN F, RILEY SHAWN, SO JOSEPH K, ALDEN DONNA M, GARGIONE ROBERT, GAZZE MARK E, DROP DAVID, BANH MAI TIEU, WANK ANDREW R
Format:	Patent
Sprache:	eng
Schlagworte:	GRINDING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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