Silicate composite polishing pad

Silicate composite polishing pad

The invention provides a polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. It includes a polymeric matrix having a polishing surface. Polymeric microelements are distributed within the polymeric matrix and at the polishing surface of the polymeric mat...

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Hauptverfasser: CAMERON, JR. COLIN F, RILEY SHAWN, SO JOSEPH K, ALDEN DONNA M, GARGIONE ROBERT, GAZZE MARK E, DROP DAVID, BANH MAI TIEU, WANK ANDREW R
Format: Patent
Sprache:eng
Schlagworte:
GRINDING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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creator CAMERON, JR. COLIN F
RILEY SHAWN
SO JOSEPH K
ALDEN DONNA M
GARGIONE ROBERT
GAZZE MARK E
DROP DAVID
BANH MAI TIEU
WANK ANDREW R
description The invention provides a polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. It includes a polymeric matrix having a polishing surface. Polymeric microelements are distributed within the polymeric matrix and at the polishing surface of the polymeric matrix. Silicate-containing regions distributed within each of the polymeric microelements coat less than 50 percent of the outer surface of the polymeric microelements. Less than 0.1 weight percent total of the polymeric microelements are associated with i) silicate particles having a particle size of greater than 5 μm; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 μm.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8257152B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8257152B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8257152B23</originalsourceid><addsrcrecordid>eNrjZFAIzszJTE4sSVVIzs8tyC_OBLIK8nMyizMy89IVChJTeBhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJfGiwhZGpuaGpkZORMRFKACUGJTg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Silicate composite polishing pad</title><source>esp@cenet</source><creator>CAMERON, JR. COLIN F ; RILEY SHAWN ; SO JOSEPH K ; ALDEN DONNA M ; GARGIONE ROBERT ; GAZZE MARK E ; DROP DAVID ; BANH MAI TIEU ; WANK ANDREW R</creator><creatorcontrib>CAMERON, JR. COLIN F ; RILEY SHAWN ; SO JOSEPH K ; ALDEN DONNA M ; GARGIONE ROBERT ; GAZZE MARK E ; DROP DAVID ; BANH MAI TIEU ; WANK ANDREW R</creatorcontrib><description>The invention provides a polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. It includes a polymeric matrix having a polishing surface. Polymeric microelements are distributed within the polymeric matrix and at the polishing surface of the polymeric matrix. Silicate-containing regions distributed within each of the polymeric microelements coat less than 50 percent of the outer surface of the polymeric microelements. Less than 0.1 weight percent total of the polymeric microelements are associated with i) silicate particles having a particle size of greater than 5 μm; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 μm.</description><language>eng</language><subject>GRINDING ; PERFORMING OPERATIONS ; POLISHING ; TOOLS FOR GRINDING, BUFFING, OR SHARPENING ; TRANSPORTING</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20120904&amp;DB=EPODOC&amp;CC=US&amp;NR=8257152B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20120904&amp;DB=EPODOC&amp;CC=US&amp;NR=8257152B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CAMERON, JR. COLIN F</creatorcontrib><creatorcontrib>RILEY SHAWN</creatorcontrib><creatorcontrib>SO JOSEPH K</creatorcontrib><creatorcontrib>ALDEN DONNA M</creatorcontrib><creatorcontrib>GARGIONE ROBERT</creatorcontrib><creatorcontrib>GAZZE MARK E</creatorcontrib><creatorcontrib>DROP DAVID</creatorcontrib><creatorcontrib>BANH MAI TIEU</creatorcontrib><creatorcontrib>WANK ANDREW R</creatorcontrib><title>Silicate composite polishing pad</title><description>The invention provides a polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. It includes a polymeric matrix having a polishing surface. Polymeric microelements are distributed within the polymeric matrix and at the polishing surface of the polymeric matrix. Silicate-containing regions distributed within each of the polymeric microelements coat less than 50 percent of the outer surface of the polymeric microelements. Less than 0.1 weight percent total of the polymeric microelements are associated with i) silicate particles having a particle size of greater than 5 μm; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 μm.</description><subject>GRINDING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAIzszJTE4sSVVIzs8tyC_OBLIK8nMyizMy89IVChJTeBhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJfGiwhZGpuaGpkZORMRFKACUGJTg</recordid><startdate>20120904</startdate><enddate>20120904</enddate><creator>CAMERON, JR. COLIN F</creator><creator>RILEY SHAWN</creator><creator>SO JOSEPH K</creator><creator>ALDEN DONNA M</creator><creator>GARGIONE ROBERT</creator><creator>GAZZE MARK E</creator><creator>DROP DAVID</creator><creator>BANH MAI TIEU</creator><creator>WANK ANDREW R</creator><scope>EVB</scope></search><sort><creationdate>20120904</creationdate><title>Silicate composite polishing pad</title><author>CAMERON, JR. COLIN F ; RILEY SHAWN ; SO JOSEPH K ; ALDEN DONNA M ; GARGIONE ROBERT ; GAZZE MARK E ; DROP DAVID ; BANH MAI TIEU ; WANK ANDREW R</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8257152B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2012</creationdate><topic>GRINDING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>CAMERON, JR. COLIN F</creatorcontrib><creatorcontrib>RILEY SHAWN</creatorcontrib><creatorcontrib>SO JOSEPH K</creatorcontrib><creatorcontrib>ALDEN DONNA M</creatorcontrib><creatorcontrib>GARGIONE ROBERT</creatorcontrib><creatorcontrib>GAZZE MARK E</creatorcontrib><creatorcontrib>DROP DAVID</creatorcontrib><creatorcontrib>BANH MAI TIEU</creatorcontrib><creatorcontrib>WANK ANDREW R</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CAMERON, JR. COLIN F</au><au>RILEY SHAWN</au><au>SO JOSEPH K</au><au>ALDEN DONNA M</au><au>GARGIONE ROBERT</au><au>GAZZE MARK E</au><au>DROP DAVID</au><au>BANH MAI TIEU</au><au>WANK ANDREW R</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Silicate composite polishing pad</title><date>2012-09-04</date><risdate>2012</risdate><abstract>The invention provides a polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. It includes a polymeric matrix having a polishing surface. Polymeric microelements are distributed within the polymeric matrix and at the polishing surface of the polymeric matrix. Silicate-containing regions distributed within each of the polymeric microelements coat less than 50 percent of the outer surface of the polymeric microelements. Less than 0.1 weight percent total of the polymeric microelements are associated with i) silicate particles having a particle size of greater than 5 μm; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 μm.</abstract><oa>free_for_read</oa></addata></record>
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subjects GRINDING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
title Silicate composite polishing pad
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-31T00%3A00%3A03IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CAMERON,%20JR.%20COLIN%20F&rft.date=2012-09-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8257152B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true