Manufacturing method of light-emitting diode

A manufacturing method of an LED comprises attaching an LED epitaxial wafer (LED wafer) to an expanding tape, dicing the LED wafer on the expanding tape longitudinally and laterally to a certain element size to divide into a plurality of LED elements, expanding the expanding tape to a certain size t...

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1. Verfasser:	HORIUCHI MEGUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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