Memory circuit having memory chips parallel connected to ports and corresponding production method

A memory circuit includes multiple memory chips configured to store data and disposed in at least one stack. The memory circuit includes multiple ports configured to receive and transmit control signals and data to and from the memory chips and to supply energy to the memory circuit. The memory circ...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MUFF SIMON, RUCKERBAUER HERMANN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	MUFF SIMON RUCKERBAUER HERMANN
description	A memory circuit includes multiple memory chips configured to store data and disposed in at least one stack. The memory circuit includes multiple ports configured to receive and transmit control signals and data to and from the memory chips and to supply energy to the memory circuit. The memory circuit includes a housing accommodating the multiple memory chips and the multiple ports.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8183676B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8183676B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8183676B23</originalsourceid><addsrcrecordid>eNqNjDEKAjEQRdNYiHqHuYCFLqxbK4qNlVovMRlNIDsTJrOCtzfCHsDqw-O_NzePCw4sH3BR3BgVgn1HesEw0RBzgWzFpoQJHBOhU_SgDJlFC1jyFYtgyUz-p2ZhPzqNTLWigf3SzJ42FVxNuzBwOt4O5zVm7qtnHRJqf792m65pd-1-2_xx-QJOGj7V</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Memory circuit having memory chips parallel connected to ports and corresponding production method</title><source>esp@cenet</source><creator>MUFF SIMON ; RUCKERBAUER HERMANN</creator><creatorcontrib>MUFF SIMON ; RUCKERBAUER HERMANN</creatorcontrib><description>A memory circuit includes multiple memory chips configured to store data and disposed in at least one stack. The memory circuit includes multiple ports configured to receive and transmit control signals and data to and from the memory chips and to supply energy to the memory circuit. The memory circuit includes a housing accommodating the multiple memory chips and the multiple ports.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120522&DB=EPODOC&CC=US&NR=8183676B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120522&DB=EPODOC&CC=US&NR=8183676B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MUFF SIMON</creatorcontrib><creatorcontrib>RUCKERBAUER HERMANN</creatorcontrib><title>Memory circuit having memory chips parallel connected to ports and corresponding production method</title><description>A memory circuit includes multiple memory chips configured to store data and disposed in at least one stack. The memory circuit includes multiple ports configured to receive and transmit control signals and data to and from the memory chips and to supply energy to the memory circuit. The memory circuit includes a housing accommodating the multiple memory chips and the multiple ports.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjDEKAjEQRdNYiHqHuYCFLqxbK4qNlVovMRlNIDsTJrOCtzfCHsDqw-O_NzePCw4sH3BR3BgVgn1HesEw0RBzgWzFpoQJHBOhU_SgDJlFC1jyFYtgyUz-p2ZhPzqNTLWigf3SzJ42FVxNuzBwOt4O5zVm7qtnHRJqf792m65pd-1-2_xx-QJOGj7V</recordid><startdate>20120522</startdate><enddate>20120522</enddate><creator>MUFF SIMON</creator><creator>RUCKERBAUER HERMANN</creator><scope>EVB</scope></search><sort><creationdate>20120522</creationdate><title>Memory circuit having memory chips parallel connected to ports and corresponding production method</title><author>MUFF SIMON ; RUCKERBAUER HERMANN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8183676B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2012</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MUFF SIMON</creatorcontrib><creatorcontrib>RUCKERBAUER HERMANN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MUFF SIMON</au><au>RUCKERBAUER HERMANN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Memory circuit having memory chips parallel connected to ports and corresponding production method</title><date>2012-05-22</date><risdate>2012</risdate><abstract>A memory circuit includes multiple memory chips configured to store data and disposed in at least one stack. The memory circuit includes multiple ports configured to receive and transmit control signals and data to and from the memory chips and to supply energy to the memory circuit. The memory circuit includes a housing accommodating the multiple memory chips and the multiple ports.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_US8183676B2
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	Memory circuit having memory chips parallel connected to ports and corresponding production method
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-01T06%3A45%3A03IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MUFF%20SIMON&rft.date=2012-05-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8183676B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true