Fiber optic transceiver (FOT) module and method for manufacturing an FOT module

A fiber optic transceiver (FOT) module is provided that has a circuit board attached to the FOT leadframe. The circuit board, which is typically a printed circuit board (PCB), provides several advantages over typical FOT module designs in that it provides additional surface area for mounting additio...

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Hauptverfasser: HAASTEREN ADRIANUS VAN, WONG TOM SHEAU TONG, LIM TZE WEI
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creator HAASTEREN ADRIANUS VAN
WONG TOM SHEAU TONG
LIM TZE WEI
description A fiber optic transceiver (FOT) module is provided that has a circuit board attached to the FOT leadframe. The circuit board, which is typically a printed circuit board (PCB), provides several advantages over typical FOT module designs in that it provides additional surface area for mounting additional components, enables components to be moved from the motherboard into the module, allows the I/O pin count of the FOT module to be increased without increasing the width or footprint associated with the module, allows bond wires to be shortened, provides improved performance over changes in temperature, allows manufacturing yield to be improved, and enables improvements in signal integrity to be realized.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8175462B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8175462B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8175462B23</originalsourceid><addsrcrecordid>eNrjZPB3y0xKLVLILyjJTFYoKUrMK05OzSwDimi4-YdoKuTmp5TmpCok5qUo5KaWZOSnKKTlFynkJuaVpiUml5QWZealAyUVgGqhSnkYWNMSc4pTeaE0N4OCm2uIs4duakF-fGpxQWJyal5qSXxosIWhuamJmZGTkTERSgBZVzWE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Fiber optic transceiver (FOT) module and method for manufacturing an FOT module</title><source>esp@cenet</source><creator>HAASTEREN ADRIANUS VAN ; WONG TOM SHEAU TONG ; LIM TZE WEI</creator><creatorcontrib>HAASTEREN ADRIANUS VAN ; WONG TOM SHEAU TONG ; LIM TZE WEI</creatorcontrib><description>A fiber optic transceiver (FOT) module is provided that has a circuit board attached to the FOT leadframe. The circuit board, which is typically a printed circuit board (PCB), provides several advantages over typical FOT module designs in that it provides additional surface area for mounting additional components, enables components to be moved from the motherboard into the module, allows the I/O pin count of the FOT module to be increased without increasing the width or footprint associated with the module, allows bond wires to be shortened, provides improved performance over changes in temperature, allows manufacturing yield to be improved, and enables improvements in signal integrity to be realized.</description><language>eng</language><subject>ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRICITY ; TRANSMISSION</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20120508&amp;DB=EPODOC&amp;CC=US&amp;NR=8175462B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20120508&amp;DB=EPODOC&amp;CC=US&amp;NR=8175462B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HAASTEREN ADRIANUS VAN</creatorcontrib><creatorcontrib>WONG TOM SHEAU TONG</creatorcontrib><creatorcontrib>LIM TZE WEI</creatorcontrib><title>Fiber optic transceiver (FOT) module and method for manufacturing an FOT module</title><description>A fiber optic transceiver (FOT) module is provided that has a circuit board attached to the FOT leadframe. The circuit board, which is typically a printed circuit board (PCB), provides several advantages over typical FOT module designs in that it provides additional surface area for mounting additional components, enables components to be moved from the motherboard into the module, allows the I/O pin count of the FOT module to be increased without increasing the width or footprint associated with the module, allows bond wires to be shortened, provides improved performance over changes in temperature, allows manufacturing yield to be improved, and enables improvements in signal integrity to be realized.</description><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRICITY</subject><subject>TRANSMISSION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPB3y0xKLVLILyjJTFYoKUrMK05OzSwDimi4-YdoKuTmp5TmpCok5qUo5KaWZOSnKKTlFynkJuaVpiUml5QWZealAyUVgGqhSnkYWNMSc4pTeaE0N4OCm2uIs4duakF-fGpxQWJyal5qSXxosIWhuamJmZGTkTERSgBZVzWE</recordid><startdate>20120508</startdate><enddate>20120508</enddate><creator>HAASTEREN ADRIANUS VAN</creator><creator>WONG TOM SHEAU TONG</creator><creator>LIM TZE WEI</creator><scope>EVB</scope></search><sort><creationdate>20120508</creationdate><title>Fiber optic transceiver (FOT) module and method for manufacturing an FOT module</title><author>HAASTEREN ADRIANUS VAN ; WONG TOM SHEAU TONG ; LIM TZE WEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8175462B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2012</creationdate><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRICITY</topic><topic>TRANSMISSION</topic><toplevel>online_resources</toplevel><creatorcontrib>HAASTEREN ADRIANUS VAN</creatorcontrib><creatorcontrib>WONG TOM SHEAU TONG</creatorcontrib><creatorcontrib>LIM TZE WEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HAASTEREN ADRIANUS VAN</au><au>WONG TOM SHEAU TONG</au><au>LIM TZE WEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Fiber optic transceiver (FOT) module and method for manufacturing an FOT module</title><date>2012-05-08</date><risdate>2012</risdate><abstract>A fiber optic transceiver (FOT) module is provided that has a circuit board attached to the FOT leadframe. The circuit board, which is typically a printed circuit board (PCB), provides several advantages over typical FOT module designs in that it provides additional surface area for mounting additional components, enables components to be moved from the motherboard into the module, allows the I/O pin count of the FOT module to be increased without increasing the width or footprint associated with the module, allows bond wires to be shortened, provides improved performance over changes in temperature, allows manufacturing yield to be improved, and enables improvements in signal integrity to be realized.</abstract><oa>free_for_read</oa></addata></record>
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subjects ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
TRANSMISSION
title Fiber optic transceiver (FOT) module and method for manufacturing an FOT module
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-22T14%3A43%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HAASTEREN%20ADRIANUS%20VAN&rft.date=2012-05-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8175462B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true