EMI shielding scheme using sandwiched sheet metal

A peripheral card EMI shielding scheme which comprises a sandwich of three layers. The first layer comprises a chassis rear wall (e.g., constructed of sheet metal). The next layer, which in certain embodiments is the middle of the sandwich, comprises a relatively thin plate (e.g., 0.15 mm+/−0.1 mm)...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SIM VIBORA, DOGLIO JEAN, ZIELNICKI STEVEN J
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!