Method for manufacturing a semiconductor device having a silicide region comprised of a silicide of a nickel alloy

To provide a semiconductor device which can reduce an electrical resistance between a plug and a silicide region, and a manufacturing method thereof. At least one semiconductor element having a silicide region, is formed over a semiconductor substrate. An interlayer insulating film is formed over th...

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Bibliographische Detailangaben
Hauptverfasser: ICHINOSE KAZUHITO, IMAI YUKARI
Format: Patent
Sprache:eng
Schlagworte:
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