RFID tag package and tire assembly

A tire and RFID tag combine as an assembly to include a tire and a tag package mounted to a tire tag mounting surface. The tag package includes a carrier substrate having a die receiving surface and one or more interconnection tabs mounted to the die receiving surface. The tag package further includ...

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Bibliographische Detailangaben
1. Verfasser: FENKANYN JOHN MICHAEL
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A tire and RFID tag combine as an assembly to include a tire and a tag package mounted to a tire tag mounting surface. The tag package includes a carrier substrate having a die receiving surface and one or more interconnection tabs mounted to the die receiving surface. The tag package further includes a dipole antenna or other antenna configuration formed by first and second antenna members having inward ends connected to respective first and second interconnection tabs on the die receiving surface and outer antenna segments extending outward from the carrier substrate. An integrated circuit die mounts to the die receiving surface and has electrical contact(s) in contacting engagement with the interconnection tab(s). A cap member or, alternatively, a cylindrical encapsulating member, may be utilized for enclosing the integrated circuit die, the carrier substrate, and the inward ends of the first and second antenna members; the outer antenna segments of the first and second antenna members extending outward from the cap member or encapsulating member in operable position against respective portions of the tire tag mounting surface.