Semiconductor power module

Use of Pb-free solder has become essential due to the environmental problem. A power module is formed by soldering substrates with large areas. It is known that in Sn-3Ag-0.5Cu which hardly creeps and deforms with respect to large deformation followed by warpage of the substrate, life is significant...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SOGA TASAO, MORISAKI EIICHI, SUZUKI KAZUHIRO, SHIMOKAWA HANAE, SAITO KATSUAKI, KAWASE DAISUKE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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