Method of manufacturing an image sensor module

Provided is an image sensor module including a lower substrate having a plurality of top pads formed on the top surface thereof; an upper substrate that is installed along the edge of the top surface of the lower substrate and has a plurality of connection grooves formed on the inner side surface th...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	LEE KYOUNG TAI
Format:	Patent
Sprache:	eng
Schlagworte:	ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!