Interconnect structures and methods

Interconnect structures and methods are disclosed. In one embodiment, an interconnect structure includes a via extendable through a workpiece from a first side of the workpiece to a second side of the workpiece. The via is partially filled with a conductive material and has sidewalls. The interconne...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	RUCKMICH STEFAN, SCHEDEL THORSTEN, ZIMMERMANN BERND, BERGHOF VOLKER
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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