Chip structure and stacked structure of chips

A chip structure and a stacked structure composed of the chip structures are provided. The chip structure has a substrate and at least one compliant contact. Furthermore, the chip structure may further have a redistribution layer for redistributing pads originally disposed around the substrate in a specific arrangement. The substrate has a first surface and a second surface. The compliant contact is embedded into the substrate and protrudes outside the first surface and the second surface of the substrate. The compliant contact has a compliant bump and a conductive layer encapsulating the compliant bump. The conductive layer can be connected with the redistribution layer. Two chip structures can be connected with each other through their compliant contacts or through their compliant contacts or redistribution layers.