Method for fabricating plated product

A bumper molding is fabricated by disposing segmented anodes 31 and 32 on surfaces 22 and 24 of a base material 20, which are to be plated, and performing electroplating so as to form metal films on the surfaces 22 and 24, respectively. The curvature of a surface of a concave portion, which is forme...

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Bibliographische Detailangaben

Hauptverfasser:	NASU MASATO, INOUE TAKESHI, MATSUOKA RYOJI, FURUTANI MUNEO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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