Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and manufacturing method of semiconductor device

A semiconductor device includes a semiconductor element; a plate member disposed opposite to an electronic-circuit forming portion of the semiconductor element; and an elastic body arranged in a compressed state between the semiconductor element and the plate member, wherein the elastic body include...

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Hauptverfasser: NISHIMURA TAKAO, KUMAGAYA YOSHIKAZU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator NISHIMURA TAKAO
KUMAGAYA YOSHIKAZU
description A semiconductor device includes a semiconductor element; a plate member disposed opposite to an electronic-circuit forming portion of the semiconductor element; and an elastic body arranged in a compressed state between the semiconductor element and the plate member, wherein the elastic body includes at least one first protruding portion at one end in an extension direction of the elastic body, the first protruding portion being formed opposite to the electronic-circuit forming portion of the semiconductor element, and the semiconductor element and the plate member are fastened by an adhesive agent.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor device and manufacturing method of semiconductor device
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