Methods and apparatus for purging a substrate carrier

In a first aspect, a substrate carrier is provided that includes an enclosure adapted to be sealable and to house at least one substrate. The substrate carrier includes a first port leading into the enclosure and adapted to allow a flow of gas into the enclosure while the substrate carrier is closed...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SHAH VINAY K, HUDGENS JEFFREY C, ELLIOTT MARTIN, ENGLHARDT ERIC
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SHAH VINAY K
HUDGENS JEFFREY C
ELLIOTT MARTIN
ENGLHARDT ERIC
description In a first aspect, a substrate carrier is provided that includes an enclosure adapted to be sealable and to house at least one substrate. The substrate carrier includes a first port leading into the enclosure and adapted to allow a flow of gas into the enclosure while the substrate carrier is closed. Numerous other aspects are provided.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8074597B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8074597B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8074597B23</originalsourceid><addsrcrecordid>eNrjZDD1TS3JyE8pVkjMS1FILChILEosKS1WSMsvUigoLUrPzEtXSFQoLk0qLgFKpCokJxYVZaYW8TCwpiXmFKfyQmluBgU31xBnD93Ugvz41OKCxOTUvNSS-NBgCwNzE1NLcycjYyKUAAActi0f</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Methods and apparatus for purging a substrate carrier</title><source>esp@cenet</source><creator>SHAH VINAY K ; HUDGENS JEFFREY C ; ELLIOTT MARTIN ; ENGLHARDT ERIC</creator><creatorcontrib>SHAH VINAY K ; HUDGENS JEFFREY C ; ELLIOTT MARTIN ; ENGLHARDT ERIC</creatorcontrib><description>In a first aspect, a substrate carrier is provided that includes an enclosure adapted to be sealable and to house at least one substrate. The substrate carrier includes a first port leading into the enclosure and adapted to allow a flow of gas into the enclosure while the substrate carrier is closed. Numerous other aspects are provided.</description><language>eng</language><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20111213&amp;DB=EPODOC&amp;CC=US&amp;NR=8074597B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20111213&amp;DB=EPODOC&amp;CC=US&amp;NR=8074597B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHAH VINAY K</creatorcontrib><creatorcontrib>HUDGENS JEFFREY C</creatorcontrib><creatorcontrib>ELLIOTT MARTIN</creatorcontrib><creatorcontrib>ENGLHARDT ERIC</creatorcontrib><title>Methods and apparatus for purging a substrate carrier</title><description>In a first aspect, a substrate carrier is provided that includes an enclosure adapted to be sealable and to house at least one substrate. The substrate carrier includes a first port leading into the enclosure and adapted to allow a flow of gas into the enclosure while the substrate carrier is closed. Numerous other aspects are provided.</description><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD1TS3JyE8pVkjMS1FILChILEosKS1WSMsvUigoLUrPzEtXSFQoLk0qLgFKpCokJxYVZaYW8TCwpiXmFKfyQmluBgU31xBnD93Ugvz41OKCxOTUvNSS-NBgCwNzE1NLcycjYyKUAAActi0f</recordid><startdate>20111213</startdate><enddate>20111213</enddate><creator>SHAH VINAY K</creator><creator>HUDGENS JEFFREY C</creator><creator>ELLIOTT MARTIN</creator><creator>ENGLHARDT ERIC</creator><scope>EVB</scope></search><sort><creationdate>20111213</creationdate><title>Methods and apparatus for purging a substrate carrier</title><author>SHAH VINAY K ; HUDGENS JEFFREY C ; ELLIOTT MARTIN ; ENGLHARDT ERIC</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8074597B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SHAH VINAY K</creatorcontrib><creatorcontrib>HUDGENS JEFFREY C</creatorcontrib><creatorcontrib>ELLIOTT MARTIN</creatorcontrib><creatorcontrib>ENGLHARDT ERIC</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHAH VINAY K</au><au>HUDGENS JEFFREY C</au><au>ELLIOTT MARTIN</au><au>ENGLHARDT ERIC</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Methods and apparatus for purging a substrate carrier</title><date>2011-12-13</date><risdate>2011</risdate><abstract>In a first aspect, a substrate carrier is provided that includes an enclosure adapted to be sealable and to house at least one substrate. The substrate carrier includes a first port leading into the enclosure and adapted to allow a flow of gas into the enclosure while the substrate carrier is closed. Numerous other aspects are provided.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US8074597B2
source esp@cenet
subjects APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
title Methods and apparatus for purging a substrate carrier
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-20T06%3A33%3A55IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SHAH%20VINAY%20K&rft.date=2011-12-13&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8074597B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true