Molded component, electronic apparatus, and method of producing a molded component

A molded component includes: a primary molded layer including a boxlike base portion that has a width direction in a first direction, a length direction in a second direction, and a height direction in a third direction and includes a first surface protruding in the third direction and a second surf...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KAJIKAWA KATSUHARU, TORIMOTO MASASHI, KOBAYASHI FUJIO, ARAI SHIZUO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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