Method of manufacturing a package carrier
A package carrier enclosing at least one microelectronic element has a pattern of electrically conductive connection pads for electric connection of the package to another device. The package carrier is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern to o...
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| creator | WEEKAMP JOHANNES WILHELMUS VAN DEN ACKERVEKEN ANTONIUS CONSTANT JOHANNA CORNELIS ANSEMS WILL J. H |
| description | A package carrier enclosing at least one microelectronic element has a pattern of electrically conductive connection pads for electric connection of the package to another device. The package carrier is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern to one side of the carrier; bending the carrier to create a shape having an elevated portion and recessed portions; forming a body member on the carrier at the side where the electrically conductive pattern is present; removing the sacrificial carrier; and placing a microelectronic element in a recess created in the body member at the position where the elevated portion of the carrier has been, and connecting the microelectronic element to the electrically conductive pattern. Furthermore, a hole in the package provides access to a sensitive surface of the microelectronic element. |
| format | Patent |
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| language | eng |
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| subjects | MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING |
| title | Method of manufacturing a package carrier |
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