Electroless gold plating bath, electroless gold plating method and electronic parts

An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, a formaldehyde metabisulfite adduct, and an amine compound represented by R1-NH-C2H4-NH-R2 or (CH2-NH-C2H4-NH-CH2)n-R4 (wherein R1 to R4 represent -OH, -CH3, -CH2OH, -C2H4OH, -CH2N(CH3)2, -CH2NH(CH2OH), -CH2...

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Bibliographische Detailangaben

Hauptverfasser:	TANABE KATSUHISA, KUROSAKA SEIGO, KISO MASAYUKI, KAMITAMARI TOHRU, SAIJO YOSHIKAZU, ODA YUKINORI
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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