Electrical connector system
High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed conne...
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| creator | GLOVER DOUGLAS W KNAUB JOHN E HELSTER DAVID W WICKES EVAN CHARLES FEDDER JAMES L MINNICK TIMOTHY R MORGAN CHAD W SIPE LYNN R SHARF ALEX M |
| description | High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US7976318B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US7976318B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US7976318B23</originalsourceid><addsrcrecordid>eNrjZJB2zUlNLinKTE7MUUjOz8sDcvKLFIori0tSc3kYWNMSc4pTeaE0N4OCm2uIs4duakF-fGpxQWJyal5qSXxosLmluZmxoYWTkTERSgBUoyOO</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electrical connector system</title><source>esp@cenet</source><creator>GLOVER DOUGLAS W ; KNAUB JOHN E ; HELSTER DAVID W ; WICKES EVAN CHARLES ; FEDDER JAMES L ; MINNICK TIMOTHY R ; MORGAN CHAD W ; SIPE LYNN R ; SHARF ALEX M</creator><creatorcontrib>GLOVER DOUGLAS W ; KNAUB JOHN E ; HELSTER DAVID W ; WICKES EVAN CHARLES ; FEDDER JAMES L ; MINNICK TIMOTHY R ; MORGAN CHAD W ; SIPE LYNN R ; SHARF ALEX M</creatorcontrib><description>High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CURRENT COLLECTORS ; ELECTRICITY ; LINE CONNECTORS</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110712&DB=EPODOC&CC=US&NR=7976318B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110712&DB=EPODOC&CC=US&NR=7976318B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GLOVER DOUGLAS W</creatorcontrib><creatorcontrib>KNAUB JOHN E</creatorcontrib><creatorcontrib>HELSTER DAVID W</creatorcontrib><creatorcontrib>WICKES EVAN CHARLES</creatorcontrib><creatorcontrib>FEDDER JAMES L</creatorcontrib><creatorcontrib>MINNICK TIMOTHY R</creatorcontrib><creatorcontrib>MORGAN CHAD W</creatorcontrib><creatorcontrib>SIPE LYNN R</creatorcontrib><creatorcontrib>SHARF ALEX M</creatorcontrib><title>Electrical connector system</title><description>High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB2zUlNLinKTE7MUUjOz8sDcvKLFIori0tSc3kYWNMSc4pTeaE0N4OCm2uIs4duakF-fGpxQWJyal5qSXxosLmluZmxoYWTkTERSgBUoyOO</recordid><startdate>20110712</startdate><enddate>20110712</enddate><creator>GLOVER DOUGLAS W</creator><creator>KNAUB JOHN E</creator><creator>HELSTER DAVID W</creator><creator>WICKES EVAN CHARLES</creator><creator>FEDDER JAMES L</creator><creator>MINNICK TIMOTHY R</creator><creator>MORGAN CHAD W</creator><creator>SIPE LYNN R</creator><creator>SHARF ALEX M</creator><scope>EVB</scope></search><sort><creationdate>20110712</creationdate><title>Electrical connector system</title><author>GLOVER DOUGLAS W ; KNAUB JOHN E ; HELSTER DAVID W ; WICKES EVAN CHARLES ; FEDDER JAMES L ; MINNICK TIMOTHY R ; MORGAN CHAD W ; SIPE LYNN R ; SHARF ALEX M</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7976318B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><toplevel>online_resources</toplevel><creatorcontrib>GLOVER DOUGLAS W</creatorcontrib><creatorcontrib>KNAUB JOHN E</creatorcontrib><creatorcontrib>HELSTER DAVID W</creatorcontrib><creatorcontrib>WICKES EVAN CHARLES</creatorcontrib><creatorcontrib>FEDDER JAMES L</creatorcontrib><creatorcontrib>MINNICK TIMOTHY R</creatorcontrib><creatorcontrib>MORGAN CHAD W</creatorcontrib><creatorcontrib>SIPE LYNN R</creatorcontrib><creatorcontrib>SHARF ALEX M</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GLOVER DOUGLAS W</au><au>KNAUB JOHN E</au><au>HELSTER DAVID W</au><au>WICKES EVAN CHARLES</au><au>FEDDER JAMES L</au><au>MINNICK TIMOTHY R</au><au>MORGAN CHAD W</au><au>SIPE LYNN R</au><au>SHARF ALEX M</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electrical connector system</title><date>2011-07-12</date><risdate>2011</risdate><abstract>High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS ELECTRICITY LINE CONNECTORS |
| title | Electrical connector system |
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