Adhesive application apparatus for use with an assembling machine
The invention relates to an adhesive application apparatus for use with an assembling machine for assembling operatively upper and lower components for carrying printhead integrated circuits. The application apparatus includes a plate and a dispensing mechanism which includes an adhesive reservoir,...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The invention relates to an adhesive application apparatus for use with an assembling machine for assembling operatively upper and lower components for carrying printhead integrated circuits. The application apparatus includes a plate and a dispensing mechanism which includes an adhesive reservoir, said mechanism being operatively engaged with said plate in a sealing and sliding manner, the mechanism configured to dispense adhesive onto the plate when sliding along the plate. The apparatus also includes a displacement mechanism to slide the dispensing mechanism along the plate, and a control system to control operation of the dispensing and displacement mechanisms. |
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