Chip arrangement and method of manufacturing a chip arrangement

A chip arrangement includes a logic chip with electric contacts arranged on one side, at least one memory chip arrangement with electrical contacts arranged on at least one side, and a substrate with electrical contacts on both sides of the substrate. The logic chip is attached to the substrate and...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HEDLER HARRY, IRSIGLER ROLAND
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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