Semiconductor device fabrication method

The method comprises the step polishing the surface of a film-to-be-polished formed over a semiconductor substrate 10 with a polishing pad while a polishing slurry containing abrasive grains, and an additive of a surfactant is being supplied onto the polishing pad 104 to thereby planarize the surfac...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IDANI NAOKI, ISOME TOSHIYUKI, WATANABE TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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