Optimized lid attach process for thermal management and multi-surface compliant heat removal

Optimized lid attach process for thermal management and multi-surface compliant heat removal

A multi-surface compliant heat removal process includes: identifying one or more components to share a heat rejecting device, applying non-adhesive film to the one or more components, identifying a primary component of the one or more components, and applying phase change material on each of the one...

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Hauptverfasser: GEKTIN VADIM, MALLADI DEVIPRASAD
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator GEKTIN VADIM
MALLADI DEVIPRASAD
description A multi-surface compliant heat removal process includes: identifying one or more components to share a heat rejecting device, applying non-adhesive film to the one or more components, identifying a primary component of the one or more components, and applying phase change material on each of the one or more components other than the primary component. The phase change material is placed on top of the non-adhesive film. The process further includes placing the heat rejecting device on the corresponding one or more components and removing the heat rejecting device from the corresponding one or more components. The phase change material and the non-adhesive film remain with the heat rejecting device. The process also includes reflowing the phase change material on the heat rejecting device, removing the non-adhesive film from the heat rejecting device, placing a heatsink-attach thermal interface material on the one or more components, and placing the heat rejecting device on the corresponding one or more components.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Optimized lid attach process for thermal management and multi-surface compliant heat removal
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