Semiconductor chip with solder joint protection ring

Various semiconductor chip arrangements and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip that has an external peripheral wall to a first side of a substrate. A first metallic ring is coupled to the first si...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHAI JUN, KHAN MOHAMMAD, MASTER RAJ N, GANNAMANI RANJIT
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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