Substrate holder and electroplating system
In one embodiment, a substrate holder comprises a base supporting a substrate that includes a surface having a peripheral region. A cover may be assembled with the base and includes at least one opening exposing only a portion of the surface therethrough. A seal assembly substantially seals a region...
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creator | DUBIN VALERY M BLANCHARD JAMES D |
description | In one embodiment, a substrate holder comprises a base supporting a substrate that includes a surface having a peripheral region. A cover may be assembled with the base and includes at least one opening exposing only a portion of the surface therethrough. A seal assembly substantially seals a region between the cover and base and further adjacent to the peripheral region of the substrate. An electrode includes at least one contact portion positioned within the region and extending over at least a portion of the peripheral region of the substrate. A compliant member comprises a polymeric material and may be positioned within the region between the at least one contact portion and either the peripheral region of the substrate or the cover. In other embodiments, an electroplating system is disclosed that may employ such a substrate holder. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US7905994B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US7905994B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US7905994B23</originalsourceid><addsrcrecordid>eNrjZNAKLk0qLilKLElVyMjPSUktUkjMS1FIzUlNLinKL8hJLMnMS1coriwuSc3lYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxocHmlgamlpYmTkbGRCgBABraKWk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Substrate holder and electroplating system</title><source>esp@cenet</source><creator>DUBIN VALERY M ; BLANCHARD JAMES D</creator><creatorcontrib>DUBIN VALERY M ; BLANCHARD JAMES D</creatorcontrib><description>In one embodiment, a substrate holder comprises a base supporting a substrate that includes a surface having a peripheral region. A cover may be assembled with the base and includes at least one opening exposing only a portion of the surface therethrough. A seal assembly substantially seals a region between the cover and base and further adjacent to the peripheral region of the substrate. An electrode includes at least one contact portion positioned within the region and extending over at least a portion of the peripheral region of the substrate. A compliant member comprises a polymeric material and may be positioned within the region between the at least one contact portion and either the peripheral region of the substrate or the cover. In other embodiments, an electroplating system is disclosed that may employ such a substrate holder.</description><language>eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTIONOF COMPOUNDS OR NON-METALS ; METALLURGY</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110315&DB=EPODOC&CC=US&NR=7905994B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110315&DB=EPODOC&CC=US&NR=7905994B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DUBIN VALERY M</creatorcontrib><creatorcontrib>BLANCHARD JAMES D</creatorcontrib><title>Substrate holder and electroplating system</title><description>In one embodiment, a substrate holder comprises a base supporting a substrate that includes a surface having a peripheral region. A cover may be assembled with the base and includes at least one opening exposing only a portion of the surface therethrough. A seal assembly substantially seals a region between the cover and base and further adjacent to the peripheral region of the substrate. An electrode includes at least one contact portion positioned within the region and extending over at least a portion of the peripheral region of the substrate. A compliant member comprises a polymeric material and may be positioned within the region between the at least one contact portion and either the peripheral region of the substrate or the cover. In other embodiments, an electroplating system is disclosed that may employ such a substrate holder.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTIONOF COMPOUNDS OR NON-METALS</subject><subject>METALLURGY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAKLk0qLilKLElVyMjPSUktUkjMS1FIzUlNLinKL8hJLMnMS1coriwuSc3lYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxocHmlgamlpYmTkbGRCgBABraKWk</recordid><startdate>20110315</startdate><enddate>20110315</enddate><creator>DUBIN VALERY M</creator><creator>BLANCHARD JAMES D</creator><scope>EVB</scope></search><sort><creationdate>20110315</creationdate><title>Substrate holder and electroplating system</title><author>DUBIN VALERY M ; BLANCHARD JAMES D</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7905994B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTIONOF COMPOUNDS OR NON-METALS</topic><topic>METALLURGY</topic><toplevel>online_resources</toplevel><creatorcontrib>DUBIN VALERY M</creatorcontrib><creatorcontrib>BLANCHARD JAMES D</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DUBIN VALERY M</au><au>BLANCHARD JAMES D</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Substrate holder and electroplating system</title><date>2011-03-15</date><risdate>2011</risdate><abstract>In one embodiment, a substrate holder comprises a base supporting a substrate that includes a surface having a peripheral region. A cover may be assembled with the base and includes at least one opening exposing only a portion of the surface therethrough. A seal assembly substantially seals a region between the cover and base and further adjacent to the peripheral region of the substrate. An electrode includes at least one contact portion positioned within the region and extending over at least a portion of the peripheral region of the substrate. A compliant member comprises a polymeric material and may be positioned within the region between the at least one contact portion and either the peripheral region of the substrate or the cover. In other embodiments, an electroplating system is disclosed that may employ such a substrate holder.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS THEREFOR CHEMISTRY ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTIONOF COMPOUNDS OR NON-METALS METALLURGY |
title | Substrate holder and electroplating system |
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