3D electronic packaging structure having a conductive support substrate

The present invention provides a 3D electronic packaging unit having a conductive supporting substrate that can achieve multi-chip stacking through the signal contacts on the both sides of the unit. The packaging unit can be batched manufactured on wafers or substrates, and thus reduce the manufactu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHOU CHAN-YEN, YEW MINGIH, CHIANG KOU-NING, YUAN CHANG-ANN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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