Integrated circuit package-on-package stacking system

An integrated circuit package-on-package stacking system includes a leadframe interposer including: a leadframe having a lead; a molded base on a portion of the lead for only supporting the lead; and the leadframe interposer singulated from the leadframe, wherein the lead is bent to support a stack-...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ASOY MA. SHIRLEY, KUAN HEAP HOE, MERILO DIOSCORO A, ONG YOU YANG, CHOW SENG GUAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!