Wire bale independent load mechanism

Electronic assemblies are described. One embodiment includes a circuit board and a socket coupled to the circuit board. The assembly also includes a load mechanism including a first lever arm and a second lever arm. The load mechanism also includes a first axis portion extending from a first longitu...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KALISZEWSKI JERRY A, LLAPITAN DAVID J
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!