Electronic parts packaging structure

In an electronic parts packaging structure of the present invention constructed by stacking a plurality of sheet-like units in a thickness direction, each of the units includes a first insulating layer, wirings formed on one surface of the first insulating layer, a semiconductor chip (electronic par...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAMANO TAKAHARU, GOMYO TOSHIO, TAKEUCHI YUKIHARU, TAKAYANAGI HIDENORI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!