Ultra thin package and fabrication method

A method includes forming a substrate layer, the substrate layer including a circuit pattern having terminals and bump pads. A stiffener is formed, the stiffener including via apertures having electrically conductive via aperture sidewalls and an electronic component opening. The stiffener is attach...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SMITH LEE JOHN, RUSLI SUKIANTO, KUO BOB SHIH-WEI, HUEMOELLER RONALD PATRICK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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