Ultra thin package and fabrication method

Ultra thin package and fabrication method

A method includes forming a substrate layer, the substrate layer including a circuit pattern having terminals and bump pads. A stiffener is formed, the stiffener including via apertures having electrically conductive via aperture sidewalls and an electronic component opening. The stiffener is attach...

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Hauptverfasser: SMITH LEE JOHN, RUSLI SUKIANTO, KUO BOB SHIH-WEI, HUEMOELLER RONALD PATRICK
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SMITH LEE JOHN
RUSLI SUKIANTO
KUO BOB SHIH-WEI
HUEMOELLER RONALD PATRICK
description A method includes forming a substrate layer, the substrate layer including a circuit pattern having terminals and bump pads. A stiffener is formed, the stiffener including via apertures having electrically conductive via aperture sidewalls and an electronic component opening. The stiffener is attached to the substrate layer. The electrically conductive via aperture sidewalls are electrically connected to the terminals. An electronic component is mounted to the bump pads and within the electronic component opening thus minimizing the height of the package. Further, the stiffener minimizing undesirable bending of the package and acts as an internal heat sink.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Ultra thin package and fabrication method
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