Multi-die IC package and manufacturing method

A method for of manufacturing integrated circuit packages and a multi-chip integrated circuit package are disclosed. According to the method, a first die is attached onto a first side of a set of leads of a leadframe, and an adhesive is applied onto the set of leads at a second side opposite to the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SUN ANTHONY YI SHENG, TAN HIEN BOON, LAW CLIFTON TEIK LYK, BIDIN RAHAMAT, WANG CHUEN KHIANG, LIU HAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!