System and method for mounting an optical component to an integrated circuit package

A packaging structure and method are provided for packaging an optoelectronic device. Generally, the packaging structure includes: (i) an integrated circuit (IC) package to which the optoelectronic device is affixed; (ii) an optical plug mounted to the IC package, the optical plug positioned relativ...

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Bibliographische Detailangaben

Hauptverfasser:	HUBER EDWARD D, SPURLOCK BRETT A, TRISNADI JAHJA I
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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