Printed circuit board and method for decreasing impedance of a power source thereof

A method for decreasing impedance of a power source in a printed circuit board includes: (a) forming a first metal plane over a first layer of the printed circuit board; (b) forming a second metal plane and a third metal plane over a second layer of the printed circuit board; (c) forming a dielectri...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SU THONAS
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!