Printed circuit board and method for decreasing impedance of a power source thereof

Printed circuit board and method for decreasing impedance of a power source thereof

A method for decreasing impedance of a power source in a printed circuit board includes: (a) forming a first metal plane over a first layer of the printed circuit board; (b) forming a second metal plane and a third metal plane over a second layer of the printed circuit board; (c) forming a dielectri...

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1. Verfasser: SU THONAS
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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description A method for decreasing impedance of a power source in a printed circuit board includes: (a) forming a first metal plane over a first layer of the printed circuit board; (b) forming a second metal plane and a third metal plane over a second layer of the printed circuit board; (c) forming a dielectric layer between the first layer and the second layer of the printed circuit board for insulating the first layer from the second layer; and (d) connecting the second metal plane to an electric potential different from an electric potential of the first metal plane and the third metal plane.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Printed circuit board and method for decreasing impedance of a power source thereof
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