High-voltage silicon-on-insulator transistors and methods of manufacturing the same

In a first aspect, a first method of manufacturing a high-voltage transistor is provided. The first method includes the steps of (1) providing a substrate including a bulk silicon layer that is below an insulator layer that is below a silicon-on-insulator (SOI) layer; and (2) forming one or more por...

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Bibliographische Detailangaben
Hauptverfasser: RADENS CARL JOHN, MANDELMAN JACK ALLAN, TONTI WILLIAM ROBERT, MA WILLIAM HSIOH-LIEN
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:In a first aspect, a first method of manufacturing a high-voltage transistor is provided. The first method includes the steps of (1) providing a substrate including a bulk silicon layer that is below an insulator layer that is below a silicon-on-insulator (SOI) layer; and (2) forming one or more portions of a transistor node including a diffusion region of the transistor in the SOI layer. A portion of the transistor node is adapted to reduce a voltage greater than about 5 V within the transistor to a voltage less than about 3 V. Numerous other aspects are provided.