Polymer resin composition, related method for forming a pattern, and related method for fabricating a capacitor

A polymer resin composition, a method for forming a pattern using the polymer resin composition, and a method for fabricating a capacitor using the polymer resin composition are disclosed. The polymer resin composition includes about 75 to 93 percent by weight of a copolymer prepared from benzyl met...

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Hauptverfasser: KANG KYONG-RIM, KIM YOUNG-HO, KIM TAE-SUNG, AHN SUN-YUL, KIM JAE-HYUN, YANG JOO-HYUNG
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creator KANG KYONG-RIM
KIM YOUNG-HO
KIM TAE-SUNG
AHN SUN-YUL
KIM JAE-HYUN
YANG JOO-HYUNG
description A polymer resin composition, a method for forming a pattern using the polymer resin composition, and a method for fabricating a capacitor using the polymer resin composition are disclosed. The polymer resin composition includes about 75 to 93 percent by weight of a copolymer prepared from benzyl methacrylate, methacrylic acid, and hydroxyethyl methacrylate; about 1 to 7 percent by weight of a cross-linking agent; about 0.01 to 0.5 percent by weight of a thermal acid generator; about 0.01 to 1 percent by weight of a photoacid generator; about 0.00001 to 0.001 percent by weight of an organic base; and a solvent.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US7781153B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US7781153B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US7781153B23</originalsourceid><addsrcrecordid>eNqNyjEKAjEQheE0FqLeYQ6gxbrIWiuKpaDWy5jMroEkEybTeHsjWlpYPH54fFPDZw7PSAJCxSewHDMXr57Tsl4BlRxE0gc7GFjeiz6NgJBRlaQqTO6nxLt4i_rRFjNaryxzMxkwFFp8OzNwPFz3pxVl7qlURYm0v126bts0m3a3bv8gL3n2QoQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Polymer resin composition, related method for forming a pattern, and related method for fabricating a capacitor</title><source>esp@cenet</source><creator>KANG KYONG-RIM ; KIM YOUNG-HO ; KIM TAE-SUNG ; AHN SUN-YUL ; KIM JAE-HYUN ; YANG JOO-HYUNG</creator><creatorcontrib>KANG KYONG-RIM ; KIM YOUNG-HO ; KIM TAE-SUNG ; AHN SUN-YUL ; KIM JAE-HYUN ; YANG JOO-HYUNG</creatorcontrib><description>A polymer resin composition, a method for forming a pattern using the polymer resin composition, and a method for fabricating a capacitor using the polymer resin composition are disclosed. The polymer resin composition includes about 75 to 93 percent by weight of a copolymer prepared from benzyl methacrylate, methacrylic acid, and hydroxyethyl methacrylate; about 1 to 7 percent by weight of a cross-linking agent; about 0.01 to 0.5 percent by weight of a thermal acid generator; about 0.01 to 1 percent by weight of a photoacid generator; about 0.00001 to 0.001 percent by weight of an organic base; and a solvent.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20100824&amp;DB=EPODOC&amp;CC=US&amp;NR=7781153B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20100824&amp;DB=EPODOC&amp;CC=US&amp;NR=7781153B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KANG KYONG-RIM</creatorcontrib><creatorcontrib>KIM YOUNG-HO</creatorcontrib><creatorcontrib>KIM TAE-SUNG</creatorcontrib><creatorcontrib>AHN SUN-YUL</creatorcontrib><creatorcontrib>KIM JAE-HYUN</creatorcontrib><creatorcontrib>YANG JOO-HYUNG</creatorcontrib><title>Polymer resin composition, related method for forming a pattern, and related method for fabricating a capacitor</title><description>A polymer resin composition, a method for forming a pattern using the polymer resin composition, and a method for fabricating a capacitor using the polymer resin composition are disclosed. The polymer resin composition includes about 75 to 93 percent by weight of a copolymer prepared from benzyl methacrylate, methacrylic acid, and hydroxyethyl methacrylate; about 1 to 7 percent by weight of a cross-linking agent; about 0.01 to 0.5 percent by weight of a thermal acid generator; about 0.01 to 1 percent by weight of a photoacid generator; about 0.00001 to 0.001 percent by weight of an organic base; and a solvent.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyjEKAjEQheE0FqLeYQ6gxbrIWiuKpaDWy5jMroEkEybTeHsjWlpYPH54fFPDZw7PSAJCxSewHDMXr57Tsl4BlRxE0gc7GFjeiz6NgJBRlaQqTO6nxLt4i_rRFjNaryxzMxkwFFp8OzNwPFz3pxVl7qlURYm0v126bts0m3a3bv8gL3n2QoQ</recordid><startdate>20100824</startdate><enddate>20100824</enddate><creator>KANG KYONG-RIM</creator><creator>KIM YOUNG-HO</creator><creator>KIM TAE-SUNG</creator><creator>AHN SUN-YUL</creator><creator>KIM JAE-HYUN</creator><creator>YANG JOO-HYUNG</creator><scope>EVB</scope></search><sort><creationdate>20100824</creationdate><title>Polymer resin composition, related method for forming a pattern, and related method for fabricating a capacitor</title><author>KANG KYONG-RIM ; KIM YOUNG-HO ; KIM TAE-SUNG ; AHN SUN-YUL ; KIM JAE-HYUN ; YANG JOO-HYUNG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7781153B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>KANG KYONG-RIM</creatorcontrib><creatorcontrib>KIM YOUNG-HO</creatorcontrib><creatorcontrib>KIM TAE-SUNG</creatorcontrib><creatorcontrib>AHN SUN-YUL</creatorcontrib><creatorcontrib>KIM JAE-HYUN</creatorcontrib><creatorcontrib>YANG JOO-HYUNG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KANG KYONG-RIM</au><au>KIM YOUNG-HO</au><au>KIM TAE-SUNG</au><au>AHN SUN-YUL</au><au>KIM JAE-HYUN</au><au>YANG JOO-HYUNG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Polymer resin composition, related method for forming a pattern, and related method for fabricating a capacitor</title><date>2010-08-24</date><risdate>2010</risdate><abstract>A polymer resin composition, a method for forming a pattern using the polymer resin composition, and a method for fabricating a capacitor using the polymer resin composition are disclosed. The polymer resin composition includes about 75 to 93 percent by weight of a copolymer prepared from benzyl methacrylate, methacrylic acid, and hydroxyethyl methacrylate; about 1 to 7 percent by weight of a cross-linking agent; about 0.01 to 0.5 percent by weight of a thermal acid generator; about 0.01 to 1 percent by weight of a photoacid generator; about 0.00001 to 0.001 percent by weight of an organic base; and a solvent.</abstract><oa>free_for_read</oa></addata></record>
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subjects APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
title Polymer resin composition, related method for forming a pattern, and related method for fabricating a capacitor
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T17%3A23%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KANG%20KYONG-RIM&rft.date=2010-08-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS7781153B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true