Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Packaged microelectronic devices and methods of manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a method of manufacturing a microelectronic device includes forming a stand-off layer over a plurality of microelectronic dies on a semiconductor workpiece, and rem...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEOW SEE HIONG, TAY LIANG CHEE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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