Process for the collective fabrication of microstructures consisting of superposed elements

The invention relates to the collective fabrication of superposed microstructures, such as an integrated circuit and a protective cover. Individual structures each comprising superposed first and second elements are fabricated collectively. The first elements (for example, integrated circuit chips)...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ROMMEVEAUX PHILIPPE, ASPAR BERNARD
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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