Electronic parts board and method of producing the same

An electronic component substrate (1-1) includes an insulating base (10) and a flexible circuit board (20) mounted on the insulating base (10). The flexible circuit board (20) is a synthetic resin film provided thereon with terminal patterns (29) and a conductor pattern (25) whose surface is sliding...

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Hauptverfasser:	MITSUI KOJI, FUKUDA NAOKI, YANOSHITA KATSUTOSHI, MAKINO DAISUKE, NAKAGOME KAZUTAKA, MORITA KOZO, MIZUNO SHINJI, SHINOKI TAKASHI, SUZUKI SHINICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESISTORS
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creator	MITSUI KOJI FUKUDA NAOKI YANOSHITA KATSUTOSHI MAKINO DAISUKE NAKAGOME KAZUTAKA MORITA KOZO MIZUNO SHINJI SHINOKI TAKASHI SUZUKI SHINICHI
description	An electronic component substrate (1-1) includes an insulating base (10) and a flexible circuit board (20) mounted on the insulating base (10). The flexible circuit board (20) is a synthetic resin film provided thereon with terminal patterns (29) and a conductor pattern (25) whose surface is slidingly contacted with a slider. The insulating base (10) is a synthetic resin molded piece. The flexible circuit board (20) is insert-molded to the insulating base (10). The electronic component substrate (1-1) is produced by preparing the flexible circuit board (20) and first and second mold members (41, 45) having a cavity (C1) with a shape that corresponds to the external shape of the electronic component substrate (1-1). Then, the flexible circuit board (20) is accommodated in the cavity (C1) between the first and second mold members (41,45), and the cavity (C1) is filled with a molten molding resin. After the molding resin has solidified, the first and second mold members (41, 45) are removed.
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subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESISTORS
title	Electronic parts board and method of producing the same
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