Chip transfer method and apparatus
In a chip transferring apparatus a wafer (44) and a lead frame (50) are positioned. A first chip (42) is picked up from the wafer (44) by a transfer head (14; 40a-40d) in a chip pick-up position, while bonding a second chip to the lead frame (50) by another transfer head in a chip bonding position....
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| creator | WETZELS LEON DERKS WILHELMUS JOHANNUS THEODORUS KAMPSCHREUR THOMAS MARKUS KAMPHUIS ANTONIUS HENDRIKUS JOZEF STOKKERMANS JOEP BOSCH JOHANNES WILHELMUS DOROTHEUS |
| description | In a chip transferring apparatus a wafer (44) and a lead frame (50) are positioned. A first chip (42) is picked up from the wafer (44) by a transfer head (14; 40a-40d) in a chip pick-up position, while bonding a second chip to the lead frame (50) by another transfer head in a chip bonding position. The first chip (42) is then transferred by said one of the transfer heads from the chip pick-up position to the chip bonding position. Next, the first chip (42) is bonded on the lead frame (50) by said one of the transfer heads (14; 40a-40d) in the chip bonding position, while another one of the transfer heads picks up a third chip from the wafer (44) in the chip pick-up position. Each transfer head (14; 40a-40d) comprises a collet (66a-66d) which, through a mechanical coupling, is coupled to another collet for compensating radial forces exerted on the collet relative to said axis of rotation. Vacuum is transferred to the collet from a stationary pressure source by groove sections (106) in a transfer assembly stator (100) communicating through a gap (104) between the rotatable transfer assembly (32) and the transfer assembly stator (100) with gas ducts in the transfer head (14; 40a-40d) and the corresponding collet (66a-66d). A chip (42) is picked up from a wafer (44) by a needle mechanism (224). |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US7726011B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US7726011B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US7726011B23</originalsourceid><addsrcrecordid>eNrjZFByzsgsUCgpSswrTkstUshNLcnIT1FIzAPigoLEosSS0mIeBta0xJziVF4ozc2g4OYa4uyhm1qQH59aXJCYnJqXWhIfGmxubmRmYGjoZGRMhBIAZPEluQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Chip transfer method and apparatus</title><source>esp@cenet</source><creator>WETZELS LEON ; DERKS WILHELMUS JOHANNUS THEODORUS ; KAMPSCHREUR THOMAS MARKUS ; KAMPHUIS ANTONIUS HENDRIKUS JOZEF ; STOKKERMANS JOEP ; BOSCH JOHANNES WILHELMUS DOROTHEUS</creator><creatorcontrib>WETZELS LEON ; DERKS WILHELMUS JOHANNUS THEODORUS ; KAMPSCHREUR THOMAS MARKUS ; KAMPHUIS ANTONIUS HENDRIKUS JOZEF ; STOKKERMANS JOEP ; BOSCH JOHANNES WILHELMUS DOROTHEUS</creatorcontrib><description>In a chip transferring apparatus a wafer (44) and a lead frame (50) are positioned. A first chip (42) is picked up from the wafer (44) by a transfer head (14; 40a-40d) in a chip pick-up position, while bonding a second chip to the lead frame (50) by another transfer head in a chip bonding position. The first chip (42) is then transferred by said one of the transfer heads from the chip pick-up position to the chip bonding position. Next, the first chip (42) is bonded on the lead frame (50) by said one of the transfer heads (14; 40a-40d) in the chip bonding position, while another one of the transfer heads picks up a third chip from the wafer (44) in the chip pick-up position. Each transfer head (14; 40a-40d) comprises a collet (66a-66d) which, through a mechanical coupling, is coupled to another collet for compensating radial forces exerted on the collet relative to said axis of rotation. Vacuum is transferred to the collet from a stationary pressure source by groove sections (106) in a transfer assembly stator (100) communicating through a gap (104) between the rotatable transfer assembly (32) and the transfer assembly stator (100) with gas ducts in the transfer head (14; 40a-40d) and the corresponding collet (66a-66d). A chip (42) is picked up from a wafer (44) by a needle mechanism (224).</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMBINED OPERATIONS ; CONVEYING ; CRANES ; CURRENT COLLECTORS ; DREDGING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FIXED CONSTRUCTIONS ; FOUNDATIONS ; HANDLING THIN OR FILAMENTARY MATERIAL ; HAULING ; HOISTING ; HOISTING, LIFTING, HAULING OR PUSHING, NOT OTHERWISE PROVIDEDFOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCEDIRECTLY TO THE SURFACE OF A LOAD ; HYDRAULIC ENGINEERING ; LIFTING ; LINE CONNECTORS ; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS,WINCHES, OR TACKLES ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; OTHER WORKING OF METAL ; PACKING ; PERFORMING OPERATIONS ; PNEUMATIC TUBE CONVEYORS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; SHOP CONVEYOR SYSTEMS ; SOIL SHIFTING ; STORING ; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING ; TRANSPORTING ; UNIVERSAL MACHINE TOOLS</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100601&DB=EPODOC&CC=US&NR=7726011B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100601&DB=EPODOC&CC=US&NR=7726011B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WETZELS LEON</creatorcontrib><creatorcontrib>DERKS WILHELMUS JOHANNUS THEODORUS</creatorcontrib><creatorcontrib>KAMPSCHREUR THOMAS MARKUS</creatorcontrib><creatorcontrib>KAMPHUIS ANTONIUS HENDRIKUS JOZEF</creatorcontrib><creatorcontrib>STOKKERMANS JOEP</creatorcontrib><creatorcontrib>BOSCH JOHANNES WILHELMUS DOROTHEUS</creatorcontrib><title>Chip transfer method and apparatus</title><description>In a chip transferring apparatus a wafer (44) and a lead frame (50) are positioned. A first chip (42) is picked up from the wafer (44) by a transfer head (14; 40a-40d) in a chip pick-up position, while bonding a second chip to the lead frame (50) by another transfer head in a chip bonding position. The first chip (42) is then transferred by said one of the transfer heads from the chip pick-up position to the chip bonding position. Next, the first chip (42) is bonded on the lead frame (50) by said one of the transfer heads (14; 40a-40d) in the chip bonding position, while another one of the transfer heads picks up a third chip from the wafer (44) in the chip pick-up position. Each transfer head (14; 40a-40d) comprises a collet (66a-66d) which, through a mechanical coupling, is coupled to another collet for compensating radial forces exerted on the collet relative to said axis of rotation. Vacuum is transferred to the collet from a stationary pressure source by groove sections (106) in a transfer assembly stator (100) communicating through a gap (104) between the rotatable transfer assembly (32) and the transfer assembly stator (100) with gas ducts in the transfer head (14; 40a-40d) and the corresponding collet (66a-66d). A chip (42) is picked up from a wafer (44) by a needle mechanism (224).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMBINED OPERATIONS</subject><subject>CONVEYING</subject><subject>CRANES</subject><subject>CURRENT COLLECTORS</subject><subject>DREDGING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FIXED CONSTRUCTIONS</subject><subject>FOUNDATIONS</subject><subject>HANDLING THIN OR FILAMENTARY MATERIAL</subject><subject>HAULING</subject><subject>HOISTING</subject><subject>HOISTING, LIFTING, HAULING OR PUSHING, NOT OTHERWISE PROVIDEDFOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCEDIRECTLY TO THE SURFACE OF A LOAD</subject><subject>HYDRAULIC ENGINEERING</subject><subject>LIFTING</subject><subject>LINE CONNECTORS</subject><subject>LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS,WINCHES, OR TACKLES</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>OTHER WORKING OF METAL</subject><subject>PACKING</subject><subject>PERFORMING OPERATIONS</subject><subject>PNEUMATIC TUBE CONVEYORS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHOP CONVEYOR SYSTEMS</subject><subject>SOIL SHIFTING</subject><subject>STORING</subject><subject>TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING</subject><subject>TRANSPORTING</subject><subject>UNIVERSAL MACHINE TOOLS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFByzsgsUCgpSswrTkstUshNLcnIT1FIzAPigoLEosSS0mIeBta0xJziVF4ozc2g4OYa4uyhm1qQH59aXJCYnJqXWhIfGmxubmRmYGjoZGRMhBIAZPEluQ</recordid><startdate>20100601</startdate><enddate>20100601</enddate><creator>WETZELS LEON</creator><creator>DERKS WILHELMUS JOHANNUS THEODORUS</creator><creator>KAMPSCHREUR THOMAS MARKUS</creator><creator>KAMPHUIS ANTONIUS HENDRIKUS JOZEF</creator><creator>STOKKERMANS JOEP</creator><creator>BOSCH JOHANNES WILHELMUS DOROTHEUS</creator><scope>EVB</scope></search><sort><creationdate>20100601</creationdate><title>Chip transfer method and apparatus</title><author>WETZELS LEON ; DERKS WILHELMUS JOHANNUS THEODORUS ; KAMPSCHREUR THOMAS MARKUS ; KAMPHUIS ANTONIUS HENDRIKUS JOZEF ; STOKKERMANS JOEP ; BOSCH JOHANNES WILHELMUS DOROTHEUS</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7726011B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMBINED OPERATIONS</topic><topic>CONVEYING</topic><topic>CRANES</topic><topic>CURRENT COLLECTORS</topic><topic>DREDGING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FIXED CONSTRUCTIONS</topic><topic>FOUNDATIONS</topic><topic>HANDLING THIN OR FILAMENTARY MATERIAL</topic><topic>HAULING</topic><topic>HOISTING</topic><topic>HOISTING, LIFTING, HAULING OR PUSHING, NOT OTHERWISE PROVIDEDFOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCEDIRECTLY TO THE SURFACE OF A LOAD</topic><topic>HYDRAULIC ENGINEERING</topic><topic>LIFTING</topic><topic>LINE CONNECTORS</topic><topic>LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS,WINCHES, OR TACKLES</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>OTHER WORKING OF METAL</topic><topic>PACKING</topic><topic>PERFORMING OPERATIONS</topic><topic>PNEUMATIC TUBE CONVEYORS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHOP CONVEYOR SYSTEMS</topic><topic>SOIL SHIFTING</topic><topic>STORING</topic><topic>TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING</topic><topic>TRANSPORTING</topic><topic>UNIVERSAL MACHINE TOOLS</topic><toplevel>online_resources</toplevel><creatorcontrib>WETZELS LEON</creatorcontrib><creatorcontrib>DERKS WILHELMUS JOHANNUS THEODORUS</creatorcontrib><creatorcontrib>KAMPSCHREUR THOMAS MARKUS</creatorcontrib><creatorcontrib>KAMPHUIS ANTONIUS HENDRIKUS JOZEF</creatorcontrib><creatorcontrib>STOKKERMANS JOEP</creatorcontrib><creatorcontrib>BOSCH JOHANNES WILHELMUS DOROTHEUS</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WETZELS LEON</au><au>DERKS WILHELMUS JOHANNUS THEODORUS</au><au>KAMPSCHREUR THOMAS MARKUS</au><au>KAMPHUIS ANTONIUS HENDRIKUS JOZEF</au><au>STOKKERMANS JOEP</au><au>BOSCH JOHANNES WILHELMUS DOROTHEUS</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Chip transfer method and apparatus</title><date>2010-06-01</date><risdate>2010</risdate><abstract>In a chip transferring apparatus a wafer (44) and a lead frame (50) are positioned. A first chip (42) is picked up from the wafer (44) by a transfer head (14; 40a-40d) in a chip pick-up position, while bonding a second chip to the lead frame (50) by another transfer head in a chip bonding position. The first chip (42) is then transferred by said one of the transfer heads from the chip pick-up position to the chip bonding position. Next, the first chip (42) is bonded on the lead frame (50) by said one of the transfer heads (14; 40a-40d) in the chip bonding position, while another one of the transfer heads picks up a third chip from the wafer (44) in the chip pick-up position. Each transfer head (14; 40a-40d) comprises a collet (66a-66d) which, through a mechanical coupling, is coupled to another collet for compensating radial forces exerted on the collet relative to said axis of rotation. Vacuum is transferred to the collet from a stationary pressure source by groove sections (106) in a transfer assembly stator (100) communicating through a gap (104) between the rotatable transfer assembly (32) and the transfer assembly stator (100) with gas ducts in the transfer head (14; 40a-40d) and the corresponding collet (66a-66d). A chip (42) is picked up from a wafer (44) by a needle mechanism (224).</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMBINED OPERATIONS CONVEYING CRANES CURRENT COLLECTORS DREDGING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FIXED CONSTRUCTIONS FOUNDATIONS HANDLING THIN OR FILAMENTARY MATERIAL HAULING HOISTING HOISTING, LIFTING, HAULING OR PUSHING, NOT OTHERWISE PROVIDEDFOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCEDIRECTLY TO THE SURFACE OF A LOAD HYDRAULIC ENGINEERING LIFTING LINE CONNECTORS LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS,WINCHES, OR TACKLES MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR OTHER WORKING OF METAL PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS SOIL SHIFTING STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING UNIVERSAL MACHINE TOOLS |
| title | Chip transfer method and apparatus |
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