Apparatus and method for plasma treating a substrate
Apparatus is provided for plasma treating a substrate. This has a chamber (2) and a plasma generator (4) which forms a plasma from one or more gases flowing within the chamber so as to produce one or more species for interacting with a substrate (8) placed within the chamber. A guide (12) is provide...
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| creator | HASSALL GEOFFREY COOKE MICHAEL JOSEPH |
| description | Apparatus is provided for plasma treating a substrate. This has a chamber (2) and a plasma generator (4) which forms a plasma from one or more gases flowing within the chamber so as to produce one or more species for interacting with a substrate (8) placed within the chamber. A guide (12) is provided for directing the gas flow containing the species towards the substrate (8). When in use, the width of the plasma is greater than that of the substrate by an amount defining an outer region of plasma. The guide is adapted to direct the species from at least substantially all of the outer region of the plasma towards the substrate. A corresponding method of plasma treatment is also disclosed. |
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This has a chamber (2) and a plasma generator (4) which forms a plasma from one or more gases flowing within the chamber so as to produce one or more species for interacting with a substrate (8) placed within the chamber. A guide (12) is provided for directing the gas flow containing the species towards the substrate (8). When in use, the width of the plasma is greater than that of the substrate by an amount defining an outer region of plasma. The guide is adapted to direct the species from at least substantially all of the outer region of the plasma towards the substrate. A corresponding method of plasma treatment is also disclosed.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100511&DB=EPODOC&CC=US&NR=7713377B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100511&DB=EPODOC&CC=US&NR=7713377B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HASSALL GEOFFREY</creatorcontrib><creatorcontrib>COOKE MICHAEL JOSEPH</creatorcontrib><title>Apparatus and method for plasma treating a substrate</title><description>Apparatus is provided for plasma treating a substrate. This has a chamber (2) and a plasma generator (4) which forms a plasma from one or more gases flowing within the chamber so as to produce one or more species for interacting with a substrate (8) placed within the chamber. A guide (12) is provided for directing the gas flow containing the species towards the substrate (8). When in use, the width of the plasma is greater than that of the substrate by an amount defining an outer region of plasma. The guide is adapted to direct the species from at least substantially all of the outer region of the plasma towards the substrate. 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This has a chamber (2) and a plasma generator (4) which forms a plasma from one or more gases flowing within the chamber so as to produce one or more species for interacting with a substrate (8) placed within the chamber. A guide (12) is provided for directing the gas flow containing the species towards the substrate (8). When in use, the width of the plasma is greater than that of the substrate by an amount defining an outer region of plasma. The guide is adapted to direct the species from at least substantially all of the outer region of the plasma towards the substrate. A corresponding method of plasma treatment is also disclosed.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE |
| title | Apparatus and method for plasma treating a substrate |
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