Refurbishing a wafer having a low-k dielectric layer

A wafer comprising a low-k dielectric layer is refurbished for reuse. Initially, a removable layer is provided on the wafer. The low-k dielectric layer is formed over the removable layer. The overlying low-k dielectric layer is removed from the wafer by etching away the removable layer by at least p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WANG HONG, VEPA KRISHNA, MILLER PAUL V
Format: Patent
Sprache:eng
Schlagworte:
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