Method of packaging integrated circuit devices using preformed carrier

Method of packaging integrated circuit devices using preformed carrier

Disclosed is a method of packaging integrated circuit devices using a preformed carrier. In one illustrative embodiment, the method includes providing a carrier having a plurality of pockets formed therein, positioning an integrated circuit chip and a substrate in each of the plurality of pockets an...

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1. Verfasser: HONG TAN KWANG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HONG TAN KWANG
description Disclosed is a method of packaging integrated circuit devices using a preformed carrier. In one illustrative embodiment, the method includes providing a carrier having a plurality of pockets formed therein, positioning an integrated circuit chip and a substrate in each of the plurality of pockets and conductively coupling the integrated circuit chip and the substrate in each of the plurality of pockets to one another. Also disclosed is a packaged integrated circuit device including a preformed body and an integrated circuit chip and a substrate positioned within the preformed body, the integrated chip and the substrate being conductively coupled to one another.
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In one illustrative embodiment, the method includes providing a carrier having a plurality of pockets formed therein, positioning an integrated circuit chip and a substrate in each of the plurality of pockets and conductively coupling the integrated circuit chip and the substrate in each of the plurality of pockets to one another. Also disclosed is a packaged integrated circuit device including a preformed body and an integrated circuit chip and a substrate positioned within the preformed body, the integrated chip and the substrate being conductively coupled to one another.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method of packaging integrated circuit devices using preformed carrier
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